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Device Packaging Conference Presentations
Vol. 2015, Issue DPC, 2015
January 01, 2015 EDT
Embedded Power Modules – A new approach using Power Core and High Power PCB
Lars Boettcher
,
Lars Boettcher
,
S. Karaszkiewicz
,
D. Manessis
,
A. Ostmann
,
Power semiconductor packaging
embedded actives and passives
System in Package
•
https://doi.org/10.4071/2015DPC-tp42
IMAPSource Conference Papers
Boettcher, Lars, Lars Boettcher, S. Karaszkiewicz, D. Manessis, and A. Ostmann. 2015. “Embedded Power Modules – A New Approach Using Power Core and High Power PCB.”
IMAPSource Proceedings
2015 (DPC): 906–37.
https://doi.org/10.4071/2015DPC-tp42
.
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