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Device Packaging Conference Presentations
Vol. 2015, Issue DPC, 2015January 01, 2015 EDT

Automate 3D Modeling of Trace and Via Structures

Greg Caswell, Craig Hillman, Nathan Blattau, Frank Pitelli Navius, Paul Waters, Gil Sharon,
mechanical simulation and modeling reliability advanced packaging
• https://doi.org/10.4071/Poster_DfR2
IMAPSource Conference Papers
Caswell, Greg, Craig Hillman, Nathan Blattau, Frank Pitelli Navius, Paul Waters, and Gil Sharon. 2015. “Automate 3D Modeling of Trace and Via Structures.” IMAPSource Proceedings 2015 (DPC): 1753–83. https://doi.org/10.4071/Poster_DfR2.
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