Vol. 2015, Issue DPC, 2015January 01, 2015 EDT
Thin Wafer Handling Using Mechanical- or Laser-Debondable Temporary Adhesives
Thin Wafer Handling Using Mechanical- or Laser-Debondable Temporary Adhesives
David Fleming, Jong-Uk Kim, Janet Okada, Kevin Wang, Michael Gallagher, Bob Barr, Jeff Calvert, Kai Zoschke, Matthias Wegner, Michael Töpper, Thomas Rapps, Tim Griesbach, Stefan Lutter,
Fleming, David, Jong-Uk Kim, Janet Okada, Kevin Wang, Michael Gallagher, Bob Barr, Jeff Calvert, et al. 2015. “Thin Wafer Handling Using Mechanical- or Laser-Debondable Temporary Adhesives.” IMAPSource Proceedings 2015 (DPC): 419–41. https://doi.org/10.4071/2015DPC-tp12.
Powered by Scholastica, the modern academic journal management system