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Device Packaging Conference Presentations
Vol. 2015, Issue DPC, 2015
January 01, 2015 EDT
Multi Beam Full Cut Dicing of Thin Si IC Wafers
Jeroen van Borkulo
,
Richard van der Stam
,
Guido Knippels
,
thin Si wafer
laser
dicing
•
https://doi.org/10.4071/2015DPC-wp21
IMAPSource Conference Papers
Borkulo, Jeroen van, Richard van der Stam, and Guido Knippels. 2015. “Multi Beam Full Cut Dicing of Thin Si IC Wafers.”
IMAPSource Proceedings
2015 (DPC): 1446–74.
https://doi.org/10.4071/2015DPC-wp21
.
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