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Device Packaging Conference Presentations
Vol. 2015, Issue DPC, 2015January 01, 2015 EDT

Multi Beam Full Cut Dicing of Thin Si IC Wafers

Jeroen van Borkulo, Richard van der Stam, Guido Knippels,
thin Si wafer laser dicing
• https://doi.org/10.4071/2015DPC-wp21
IMAPSource Conference Papers
Borkulo, Jeroen van, Richard van der Stam, and Guido Knippels. 2015. “Multi Beam Full Cut Dicing of Thin Si IC Wafers.” IMAPSource Proceedings 2015 (DPC): 1446–74. https://doi.org/10.4071/2015DPC-wp21.
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