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Device Packaging Conference Presentations
Vol. 2015, Issue DPC, 2015
January 01, 2015 EDT
Enabling Requirements for High Volume Thermo compression Bonding
Tom Strothmann
,
thermo compression bonding
TCB
high volume manufacturing
UPH
•
https://doi.org/10.4071/2015DPC-tp54
IMAPSource Conference Papers
Strothmann, Tom. 2015. “Enabling Requirements for High Volume Thermo Compression Bonding.”
IMAPSource Proceedings
2015 (DPC): 995–1015.
https://doi.org/10.4071/2015DPC-tp54
.
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