Vol. 2015, Issue DPC, 2015January 01, 2015 EDT
Development of 2.5D and 3D IC Fabrication and Assembly Technologies
Development of 2.5D and 3D IC Fabrication and Assembly Technologies
Guilian Gao, Hong Sheng, Sangil Lee, Bong-Sub Lee, Scott McGrath, Liang Wang, Charles Woychik, Cyprian Uzoh, Grant Villavicencio, Roseann Alatorre, Sitaram Arkalgud,
Gao, Guilian, Hong Sheng, Sangil Lee, Bong-Sub Lee, Scott McGrath, Liang Wang, Charles Woychik, et al. 2015. “Development of 2.5D and 3D IC Fabrication and Assembly Technologies.” IMAPSource Proceedings 2015 (DPC): 75–108. https://doi.org/10.4071/2015DPC-ta11.