Vol. 2015, Issue DPC, 2015January 01, 2015 EDT
Design and fabrication of MEMS-type compliant overhang flip-chip interconnect for RF applications
Design and fabrication of MEMS-type compliant overhang flip-chip interconnect for RF applications
Xu, Pingye, and Michael C. Hamilton. 2015. “Design and Fabrication of MEMS-Type Compliant Overhang Flip-Chip Interconnect for RF Applications.” IMAPSource Proceedings 2015 (DPC): 2082–94. https://doi.org/10.4071/2015DPC-tha32.
Powered by Scholastica, the modern academic journal management system