Vol. 2015, Issue DPC, 2015January 01, 2015 EDT
Next-Generation Copper, Nickel and Lead-Free Metallization Products for Next-Generation Devices and Applications
Next-Generation Copper, Nickel and Lead-Free Metallization Products for Next-Generation Devices and Applications
Jonathan Prange, Yi Qin, Matthew Thorseth, Inho Lee, Masaaki Imanari, Yil-Hak Lee, Julia Woertink, Mark Lefebvre, Wataru Tachikawa, Jianwei Dong, Jeffrey Calvert,
Prange, Jonathan, Yi Qin, Matthew Thorseth, Inho Lee, Masaaki Imanari, Yil-Hak Lee, Julia Woertink, et al. 2015. “Next-Generation Copper, Nickel and Lead-Free Metallization Products for Next-Generation Devices and Applications.” IMAPSource Proceedings 2015 (DPC): 611–38. https://doi.org/10.4071/2015DPC-tp23.
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