Thorseth, Matthew A, Luis Gomez, Mark Scalisi, Bryan Lieb, Mark Lefebvre, Jeff Calvert, Dave Erickson, Bob Mikkola, Bridger Hoerner, and James Burnham. 2015. “Cu Electroplating Chemistry and Process Enabling Rapid TSV Filling with Long Bath Life.”
IMAPSource Proceedings 2015 (DPC): 510–29.
https://doi.org/10.4071/2015DPC-tp14.