Vol. 2015, Issue DPC, 2015January 01, 2015 EDT
Self Priming Low Stress Aqueous Developable Benzocyclobutene (AD-BCB) Photodielectric Materials for Advanced Wafer Level Packaging
Self Priming Low Stress Aqueous Developable Benzocyclobutene (AD-BCB) Photodielectric Materials for Advanced Wafer Level Packaging
Hua Dong, Greg Prokopowicz, Bob Barr, Joe Lachowski, Jeff Calvert, Mike Gallagher, Tina Aoude, Rosemary Bell, Sue McNamara, Masaki Kondoh, Joon-Seok Oh, David Louks, Jong-Uk Kim,
Dong, Hua, Greg Prokopowicz, Bob Barr, Joe Lachowski, Jeff Calvert, Mike Gallagher, Tina Aoude, et al. 2015. “Self Priming Low Stress Aqueous Developable Benzocyclobutene (AD-BCB) Photodielectric Materials for Advanced Wafer Level Packaging.” IMAPSource Proceedings 2015 (DPC): 679–97. https://doi.org/10.4071/2015DPC-tp26.