Vol. 2015, Issue DPC, 2015January 01, 2015 EDT
Material and Process Developments for Robust and High Reliability Glass Wafers for 2.5D Packaging
Material and Process Developments for Robust and High Reliability Glass Wafers for 2.5D Packaging
Roupen Keusseyan, Tim Mobley,
Keusseyan, Roupen, and Tim Mobley. 2015. “Material and Process Developments for Robust and High Reliability Glass Wafers for 2.5D Packaging.” IMAPSource Proceedings 2015 (DPC): 1364–77. https://doi.org/10.4071/2015DPC-wp12.