Vol. 2015, Issue DPC, 2015January 01, 2015 EDT
Advances in Fine Pitch Off-Chip Interconnections Through the Use of a Novel Surface Finish
Advances in Fine Pitch Off-Chip Interconnections Through the Use of a Novel Surface Finish
Arnd Kilian, Gustavo Ramos, Rick Nichols, Robin Taylor, Vanessa Smet, Ninad Shahane, TingChia Huang, Rao Tummala,
Kilian, Arnd, Gustavo Ramos, Rick Nichols, Robin Taylor, Vanessa Smet, Ninad Shahane, TingChia Huang, and Rao Tummala. 2015. “Advances in Fine Pitch Off-Chip Interconnections Through the Use of a Novel Surface Finish.” IMAPSource Proceedings 2015 (DPC): 1531–63. https://doi.org/10.4071/2015DPC-wp25.