ISSN 2380-4505
Vol. 2015, Issue DPC, 2015January 01, 2015 EDT
Embedded solutions: Fan-out and Embedded Dies Packages market and technology trends
Embedded solutions: Fan-out and Embedded Dies Packages market and technology trends
Jerome AZEMAR, Rozalia BEICA, Thibault BUISSON, Andrej IVANCOVIC, Amandine PIZZAGALLI,
AZEMAR, Jerome, Rozalia BEICA, Thibault BUISSON, Andrej IVANCOVIC, and Amandine PIZZAGALLI. 2015. “Embedded Solutions: Fan-out and Embedded Dies Packages Market and Technology Trends.” IMAPSource Proceedings 2015 (DPC): 182–216. https://doi.org/10.4071/2015DPC-ta21.