Vol. 2015, Issue DPC, 2015January 01, 2015 EDT
Technologies for Wafer Level MEMS Capping based on Permanent and Temporary Wafer Bonding
Technologies for Wafer Level MEMS Capping based on Permanent and Temporary Wafer Bonding
Kai Zoschke, Klaus-Dieter Lang,
Zoschke, Kai, and Klaus-Dieter Lang. 2015. “Technologies for Wafer Level MEMS Capping Based on Permanent and Temporary Wafer Bonding.” IMAPSource Proceedings 2015 (DPC): 698–725. https://doi.org/10.4071/2015DPC-tp31.