Technologies for Wafer Level MEMS Capping based on Permanent and Temporary Wafer Bonding

Kai Zoschke; Klaus-Dieter Lang

doi:10.4071/2015DPC-tp31

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Zoschke, Kai, and Klaus-Dieter Lang. 2015. “Technologies for Wafer Level MEMS Capping Based on Permanent and Temporary Wafer Bonding.” IMAPSource Proceedings 2015 (DPC): 698–725. https://doi.org/10.4071/2015DPC-tp31.

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