COMPARISON OF FOWLP VS QFN PACKAGE FROM THERMAL ASPECT

Qun Wan

doi:10.4071/2015DPC-ta23

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Wan, Qun. 2015. “COMPARISON OF FOWLP VS QFN PACKAGE FROM THERMAL ASPECT.” IMAPSource Proceedings 2015 (DPC): 248–71. https://doi.org/10.4071/2015DPC-ta23.

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