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Device Packaging Conference Presentations
Vol. 2015, Issue DPC, 2015
January 01, 2015 EDT
Bend testing of micro-scale bulk metal specimens using a chip-scale test instrument
Li-Anne Liew
,
David T. Read
,
Nicholas Barbosa
,
MEMS
materials testing
in-situ testing
•
https://doi.org/10.4071/2015DPC-tp36
IMAPSource Conference Papers
Liew, Li-Anne, David T. Read, and Nicholas Barbosa. 2015. “Bend Testing of Micro-Scale Bulk Metal Specimens Using a Chip-Scale Test Instrument.”
IMAPSource Proceedings
2015 (DPC): 827–64.
https://doi.org/10.4071/2015DPC-tp36
.
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