Vol. 2015, Issue DPC, 2015January 01, 2015 EDT
Bend testing of micro-scale bulk metal specimens using a chip-scale test instrument
Bend testing of micro-scale bulk metal specimens using a chip-scale test instrument
Li-Anne Liew, David T. Read, Nicholas Barbosa,
Liew, Li-Anne, David T. Read, and Nicholas Barbosa. 2015. “Bend Testing of Micro-Scale Bulk Metal Specimens Using a Chip-Scale Test Instrument.” IMAPSource Proceedings 2015 (DPC): 827–64. https://doi.org/10.4071/2015DPC-tp36.