Advanced Silicon Interposer for High density and High Integration Electronic Packages

SATORU KUMOCHI; Sumio Koiwa; Kosuke Suzuki; Yoshitaka Fukuoka

doi:10.4071/2015DPC-tp41

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KUMOCHI, SATORU, Sumio Koiwa, Kosuke Suzuki, and Yoshitaka Fukuoka. 2015. “Advanced Silicon Interposer for High Density and High Integration Electronic Packages.” IMAPSource Proceedings 2015 (DPC): 865–905. https://doi.org/10.4071/2015DPC-tp41.

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