Vol. 2015, Issue DPC, 2015January 01, 2015 EDT
Advanced Silicon Interposer for High density and High Integration Electronic Packages
Advanced Silicon Interposer for High density and High Integration Electronic Packages
SATORU KUMOCHI, Sumio Koiwa, Kosuke Suzuki, Yoshitaka Fukuoka,
KUMOCHI, SATORU, Sumio Koiwa, Kosuke Suzuki, and Yoshitaka Fukuoka. 2015. “Advanced Silicon Interposer for High Density and High Integration Electronic Packages.” IMAPSource Proceedings 2015 (DPC): 865–905. https://doi.org/10.4071/2015DPC-tp41.