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Device Packaging Conference Presentations
Vol. 2015, Issue DPC, 2015
January 01, 2015 EDT
Advanced Silicon Interposer for High density and High Integration Electronic Packages
SATORU KUMOCHI
,
Sumio Koiwa
,
Kosuke Suzuki
,
Yoshitaka Fukuoka
,
TSV
Embedded passive
Capacitor
•
https://doi.org/10.4071/2015DPC-tp41
IMAPSource Conference Papers
KUMOCHI, SATORU, Sumio Koiwa, Kosuke Suzuki, and Yoshitaka Fukuoka. 2015. “Advanced Silicon Interposer for High Density and High Integration Electronic Packages.”
IMAPSource Proceedings
2015 (DPC): 865–905.
https://doi.org/10.4071/2015DPC-tp41
.
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