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Device Packaging Conference Presentations
Vol. 2015, Issue DPC, 2015January 01, 2015 EDT

Advanced Silicon Interposer for High density and High Integration Electronic Packages

SATORU KUMOCHI, Sumio Koiwa, Kosuke Suzuki, Yoshitaka Fukuoka,
TSVEmbedded passiveCapacitor
https://doi.org/10.4071/2015DPC-tp41
IMAPSource Conference Papers
KUMOCHI, SATORU, Sumio Koiwa, Kosuke Suzuki, and Yoshitaka Fukuoka. 2015. “Advanced Silicon Interposer for High Density and High Integration Electronic Packages.” IMAPSource Proceedings 2015 (DPC): 865–905. https:/​/​doi.org/​10.4071/​2015DPC-tp41.
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