Vol. 2015, Issue DPC, 2015January 01, 2015 EDT
Characterization of a Semiconductor Packaging System utilizing Through Glass Via (TGV) Technology
Characterization of a Semiconductor Packaging System utilizing Through Glass Via (TGV) Technology
Tim Mobley, Roupen Keusseyan, Tim LeClair, Konstantin Yamnitskiy, Regi Nocon,
Mobley, Tim, Roupen Keusseyan, Tim LeClair, Konstantin Yamnitskiy, and Regi Nocon. 2015. “Characterization of a Semiconductor Packaging System Utilizing Through Glass Via (TGV) Technology.” IMAPSource Proceedings 2015 (DPC): 1378–1407. https://doi.org/10.4071/2015DPC-wp13.