Vol. 2015, Issue DPC, 2015January 01, 2015 EDT
Development of TSV Reveal Process Using Very Fine Si/Cu Grinding and Metal Contamination Removal
Development of TSV Reveal Process Using Very Fine Si/Cu Grinding and Metal Contamination Removal
Naoya Watanabe, Masahiro Aoyagi, Daisuke Katagawa, Tsubasa Bandoh, Takahiko Mitsui, Eiichi Yamamoto,
Watanabe, Naoya, Masahiro Aoyagi, Daisuke Katagawa, Tsubasa Bandoh, Takahiko Mitsui, and Eiichi Yamamoto. 2015. “Development of TSV Reveal Process Using Very Fine Si/Cu Grinding and Metal Contamination Removal.” IMAPSource Proceedings 2015 (DPC): 1928–55. https://doi.org/10.4071/2015DPC-tha13.