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Device Packaging Conference Presentations
Vol. 2015, Issue DPC, 2015
January 01, 2015 EDT
Temporary Bonding of Wafers, Displays, and Components
John Moore
,
Jared Pettit
,
Alex Brewer
,
Alman Law
,
temporary bonding
polymers
adhesion force
•
https://doi.org/10.4071/2015DPC-tp13
IMAPSource Conference Papers
Moore, John, Jared Pettit, Alex Brewer, and Alman Law. 2015. “Temporary Bonding of Wafers, Displays, and Components.”
IMAPSource Proceedings
2015 (DPC): 1–68.
https://doi.org/10.4071/2015DPC-tp13
.
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