Vol. 2015, Issue DPC, 2015January 01, 2015 EDT
Design of Filled One Step Chip Attach Materials (OSCA) for Conventional Mass Reflow Processing: Curing Kinetics and Solder Reflow Aspects
Design of Filled One Step Chip Attach Materials (OSCA) for Conventional Mass Reflow Processing: Curing Kinetics and Solder Reflow Aspects
Duffy, Daniel, Hemal Bhavsar, Lin Xin, Jean Liu, and Bruno Tolla. 2015. “Design of Filled One Step Chip Attach Materials (OSCA) for Conventional Mass Reflow Processing: Curing Kinetics and Solder Reflow Aspects.” IMAPSource Proceedings 2015 (DPC): 1502–29. https://doi.org/10.4071/2015DPC-wp23.
Powered by Scholastica, the modern academic journal management system