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Device Packaging Conference Presentations
Vol. 2015, Issue DPC, 2015
January 01, 2015 EDT
BGA Board Level Reliability Analysis & Optimization
Betty Yeung
,
BGA
solder joint
reliability
pcb
cte mismatch
thermal cycling
•
https://doi.org/10.4071/2015DPC-tp51
IMAPSource Conference Papers
Yeung, Betty. 2015. “BGA Board Level Reliability Analysis & Optimization.”
IMAPSource Proceedings
2015 (DPC): 958–72.
https://doi.org/10.4071/2015DPC-tp51
.
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