Vol. 2015, Issue DPC, 2015January 01, 2015 EDT
A Module-on-module Manufacturing Process and the Study of its Warpage and Signal Integrity
A Module-on-module Manufacturing Process and the Study of its Warpage and Signal Integrity
Thomas Wang, James Lin, Tony Cheng, Ping-Chi Hong, Albert Lin, Harrison Chang,
Wang, Thomas, James Lin, Tony Cheng, Ping-Chi Hong, Albert Lin, and Harrison Chang. 2015. “A Module-on-Module Manufacturing Process and the Study of Its Warpage and Signal Integrity.” IMAPSource Proceedings 2015 (DPC): 1429–44. https://doi.org/10.4071/2015DPC-wp15.