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Device Packaging Conference Presentations
Vol. 2015, Issue DPC, 2015January 01, 2015 EDT

A Module-on-module Manufacturing Process and the Study of its Warpage and Signal Integrity

Thomas Wang, James Lin, Tony Cheng, Ping-Chi Hong, Albert Lin, Harrison Chang,
Module on Module Warpage Signal Integrity
• https://doi.org/10.4071/2015DPC-wp15
IMAPSource Conference Papers
Wang, Thomas, James Lin, Tony Cheng, Ping-Chi Hong, Albert Lin, and Harrison Chang. 2015. “A Module-on-Module Manufacturing Process and the Study of Its Warpage and Signal Integrity.” IMAPSource Proceedings 2015 (DPC): 1429–44. https://doi.org/10.4071/2015DPC-wp15.
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