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Device Packaging Conference Presentations
Vol. 2015, Issue DPC, 2015January 01, 2015 EDT

Silicon Wafer Integrated Fan-out Technology

Curtis Zwenger, Ron Huemoeller, JinHan Kim, DongJean Kim, WonChul Do, SeongMin Seo,
Fan-outSilicon WaferWLFO
https://doi.org/10.4071/2015DPC-ta22
IMAPSource Conference Papers
Zwenger, Curtis, Ron Huemoeller, JinHan Kim, DongJean Kim, WonChul Do, and SeongMin Seo. 2015. “Silicon Wafer Integrated Fan-out Technology.” IMAPSource Proceedings 2015 (DPC): 217–47. https:/​/​doi.org/​10.4071/​2015DPC-ta22.
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