Vol. 2015, Issue HiTEN, 2015July 01, 2015 EDT
Investigation into the Role of Different Substrate Ni Compositions and Plating Methods on Die Attach Reliability
Investigation into the Role of Different Substrate Ni Compositions and Plating Methods on Die Attach Reliability
Jinzi Cui, R. Wayne Johnson, Michael C. Hamilton,
Cui, Jinzi, R. Wayne Johnson, and Michael C. Hamilton. 2015. “Investigation into the Role of Different Substrate Ni Compositions and Plating Methods on Die Attach Reliability.” IMAPSource Proceedings 2015 (HiTEN): 73–82. https://doi.org/10.4071/HiTEN-Session2-Paper2_6.