Vol. 2015, Issue HiTEN, 2015July 01, 2015 EDT
Increased High-Temperature Reliability and Package Hardening of Commercial Integrated Circuits (Through Die Extraction, Electroless Nickel/Gold Pad Reconditioning, and Ceramic Re-Assembly)
Increased High-Temperature Reliability and Package Hardening of Commercial Integrated Circuits (Through Die Extraction, Electroless Nickel/Gold Pad Reconditioning, and Ceramic Re-Assembly)
Spory, Erick M. 2015. “Increased High-Temperature Reliability and Package Hardening of Commercial Integrated Circuits (Through Die Extraction, Electroless Nickel/Gold Pad Reconditioning, and Ceramic Re-Assembly).” IMAPSource Proceedings 2015 (HiTEN): 123–28. https://doi.org/10.4071/HiTEN-Session3b-Paper3b_4.
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