Vol. 2015, Issue HiTEN, 2015July 01, 2015 EDT
Performance and Reliability of SiC dies, Die attach and Substrates for High Temperature Power Applications up to 300°C
Performance and Reliability of SiC dies, Die attach and Substrates for High Temperature Power Applications up to 300°C
Dean Hamilton, Liam Mills, Steve Riches, Philip Mawby,
Hamilton, Dean, Liam Mills, Steve Riches, and Philip Mawby. 2015. “Performance and Reliability of SiC Dies, Die Attach and Substrates for High Temperature Power Applications up to 300°C.” IMAPSource Proceedings 2015 (HiTEN): 200–207. https://doi.org/10.4071/HiTEN-Session6-Paper6_2.