Vol. 2015, Issue HiTEN, 2015July 01, 2015 EDT
Bonding strength of Cu/Cu joints using micro-sized Ag particle paste for high-temperature application
Bonding strength of Cu/Cu joints using micro-sized Ag particle paste for high-temperature application
H. Nishikawa, X. Liu, X. Wang, A. Fujita, N. Kamada, M. Saito,
Nishikawa, H., X. Liu, X. Wang, A. Fujita, N. Kamada, and M. Saito. 2015. “Bonding Strength of Cu/Cu Joints Using Micro-Sized Ag Particle Paste for High-Temperature Application.” IMAPSource Proceedings 2015 (HiTEN): 68–72. https://doi.org/10.4071/HiTEN-Session2-Paper2_5.