Vol. 2015, Issue HiTEN, 2015July 01, 2015 EDT
A High Temperature, High Power Density Package for SiC and GaN Power Devices
A High Temperature, High Power Density Package for SiC and GaN Power Devices
Cole, Z., B. McGee, J. Stabach, C. B. O’Neal, and B. Passmore. 2015. “A High Temperature, High Power Density Package for SiC and GaN Power Devices.” IMAPSource Proceedings 2015 (HiTEN): 208–13. https://doi.org/10.4071/HiTEN-Session6-Paper6_3.
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