Loading [Contrib]/a11y/accessibility-menu.js
IMAPSource Conference Papers
  • Menu
  • Articles
    • Ceramics Conference Papers
    • Device Packaging Conference Presentations
    • General
    • High Temperature Conference Papers
    • IMAPS Chapter Conferences
    • Symposium Proceedings
    • All
  • For Authors
  • Editorial Board
  • About
  • Issues
  • Journal Micro & Elect Pkg
  • search

    Sorry, something went wrong. Please try your search again.
    ×

    • Articles
    • Blog posts

RSS Feed

Enter the URL below into your favorite RSS reader.

https://imapsource.org/feed
×
High Temperature Conference Papers
Vol. 2015, Issue HiTEN, 2015July 01, 2015 EDT

A High Temperature, High Power Density Package for SiC and GaN Power Devices

Z. Cole, B. McGee, J. Stabach, C. B. O'Neal, B. Passmore,
Wide Bandgap High Temperature Power Density Power Packaging Silicon Carbide and Gallium Nitride
• https://doi.org/10.4071/HiTEN-Session6-Paper6_3
IMAPSource Conference Papers
Cole, Z., B. McGee, J. Stabach, C. B. O’Neal, and B. Passmore. 2015. “A High Temperature, High Power Density Package for SiC and GaN Power Devices.” IMAPSource Proceedings 2015 (HiTEN): 208–13. https://doi.org/10.4071/HiTEN-Session6-Paper6_3.
Save article as...▾
  • PDF
  • XML
  • Citation (BibTeX)

View more stats

Powered by Scholastica, the modern academic journal management system