Loading [Contrib]/a11y/accessibility-menu.js
IMAPSource Conference Papers
Menu
Articles
Ceramics Conference Papers
Device Packaging Conference Presentations
General
High Temperature Conference Papers
IMAPS Chapter Conferences
Symposium Proceedings
All
For Authors
Editorial Board
About
Issues
Journal Micro & Elect Pkg
search
Sorry, something went wrong. Please try your search again.
×
Use advanced search instead (articles only)
Articles
Blog posts
RSS Feed
Enter the URL below into your favorite RSS reader.
https://imapsource.org/feed
×
High Temperature Conference Papers
Vol. 2015, Issue HiTEN, 2015
July 01, 2015 EDT
A High Temperature, High Power Density Package for SiC and GaN Power Devices
Z. Cole
,
B. McGee
,
J. Stabach
,
C. B. O'Neal
,
B. Passmore
,
Wide Bandgap
High Temperature
Power Density
Power Packaging
Silicon Carbide
and Gallium Nitride
•
https://doi.org/10.4071/HiTEN-Session6-Paper6_3
IMAPSource Conference Papers
Cole, Z., B. McGee, J. Stabach, C. B. O’Neal, and B. Passmore. 2015. “A High Temperature, High Power Density Package for SiC and GaN Power Devices.”
IMAPSource Proceedings
2015 (HiTEN): 208–13.
https://doi.org/10.4071/HiTEN-Session6-Paper6_3
.
Save article as...
▾
PDF
XML
Citation (BibTeX)
View more stats