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Ceramics Conference Papers
Vol. 2011, Issue CICMT, 2011
September 01, 2011 EDT
3D-CERAMIC INTERCONNECTION DEVICES
Pascal METAYER
,
3D-Interconnect
Sensor packaging
MEMS packaging
Ceramics
Laser structuring
•
https://doi.org/10.4071/CICMT-2011-THA25
IMAPSource Conference Papers
METAYER, Pascal. 2011. “3D-CERAMIC INTERCONNECTION DEVICES.”
IMAPSource Proceedings
2011 (CICMT): 306–11.
https://doi.org/10.4071/CICMT-2011-THA25
.
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