Vol. 2011, Issue CICMT, 2011September 01, 2011 EDT
Microelectronics Packaging Application using post-LTCC technology
Microelectronics Packaging Application using post-LTCC technology
Yoshihiko IMANAKA, Hideyuki AMADA, Fumiaki KUMASAKA,
IMANAKA, Yoshihiko, Hideyuki AMADA, and Fumiaki KUMASAKA. 2011. “Microelectronics Packaging Application Using Post-LTCC Technology.” IMAPSource Proceedings 2011 (CICMT): 127–29. https://doi.org/10.4071/CICMT-2011-TP32.