Microelectronics Packaging Application using post-LTCC technology

Yoshihiko IMANAKA; Hideyuki AMADA; Fumiaki KUMASAKA

doi:10.4071/CICMT-2011-TP32

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IMANAKA, Yoshihiko, Hideyuki AMADA, and Fumiaki KUMASAKA. 2011. “Microelectronics Packaging Application Using Post-LTCC Technology.” IMAPSource Proceedings 2011 (CICMT): 127–29. https://doi.org/10.4071/CICMT-2011-TP32.

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