Vol. 2011, Issue DPC, 2011January 01, 2011 EDT
300mm Wafer-Level Image Sensor Packaging
300mm Wafer-Level Image Sensor Packaging
Thorsten Matthias, Bioh Kim, Gerald Mittendorfer, Paul Lindner, Moshe Kriman, Andrey Grinman, Alex Feldman,
Matthias, Thorsten, Bioh Kim, Gerald Mittendorfer, Paul Lindner, Moshe Kriman, Andrey Grinman, and Alex Feldman. 2011. “300mm Wafer-Level Image Sensor Packaging.” IMAPSource Proceedings 2011 (DPC): 699–716. https://doi.org/10.4071/2011DPC-ta33.