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Device Packaging Conference Presentations
Vol. 2011, Issue DPC, 2011January 01, 2011 EDT

300mm Wafer-Level Image Sensor Packaging

Thorsten Matthias, Bioh Kim, Gerald Mittendorfer, Paul Lindner, Moshe Kriman, Andrey Grinman, Alex Feldman,
Image sensor packaging Wafer Level Packaging Heterogenous integration
• https://doi.org/10.4071/2011DPC-ta33
IMAPSource Conference Papers
Matthias, Thorsten, Bioh Kim, Gerald Mittendorfer, Paul Lindner, Moshe Kriman, Andrey Grinman, and Alex Feldman. 2011. “300mm Wafer-Level Image Sensor Packaging.” IMAPSource Proceedings 2011 (DPC): 699–716. https://doi.org/10.4071/2011DPC-ta33.
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