300mm Wafer-Level Image Sensor Packaging

Thorsten Matthias; Bioh Kim; Gerald Mittendorfer; Paul Lindner; Moshe Kriman; Andrey Grinman; Alex Feldman

doi:10.4071/2011DPC-ta33

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Matthias, Thorsten, Bioh Kim, Gerald Mittendorfer, Paul Lindner, Moshe Kriman, Andrey Grinman, and Alex Feldman. 2011. “300mm Wafer-Level Image Sensor Packaging.” IMAPSource Proceedings 2011 (DPC): 699–716. https://doi.org/10.4071/2011DPC-ta33.

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