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Device Packaging Conference Presentations
Vol. 2011, Issue DPC, 2011
January 01, 2011 EDT
Ultrathin WLP Die Embedded Polyimide Multi-Layer Wiring Board
Satoshi Okude
,
M. Okamoto
,
Y. Sano
,
N. Ueta
,
O. Nakao
,
Embedded Die Packaging
Fan-out Array Packaging
Embedded Die SiP
•
https://doi.org/10.4071/2011DPC-tp34
IMAPSource Conference Papers
Okude, Satoshi, M. Okamoto, Y. Sano, N. Ueta, and O. Nakao. 2011. “Ultrathin WLP Die Embedded Polyimide Multi-Layer Wiring Board.”
IMAPSource Proceedings
2011 (DPC): 1071–1104.
https://doi.org/10.4071/2011DPC-tp34
.
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