Ultrathin WLP Die Embedded Polyimide Multi-Layer Wiring Board

Satoshi Okude; M. Okamoto; Y. Sano; N. Ueta; O. Nakao

doi:10.4071/2011DPC-tp34

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Okude, Satoshi, M. Okamoto, Y. Sano, N. Ueta, and O. Nakao. 2011. “Ultrathin WLP Die Embedded Polyimide Multi-Layer Wiring Board.” IMAPSource Proceedings 2011 (DPC): 1071–1104. https://doi.org/10.4071/2011DPC-tp34.

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