Vol. 2011, Issue DPC, 2011January 01, 2011 EDT
Thermal Analysis for a Novel 3D Heterogenous Integrated Platform MorPack
Thermal Analysis for a Novel 3D Heterogenous Integrated Platform MorPack
Shih-Lun Chen, Chun-Ming Huang, Chien-Ming Wu, Chih-Chyau Yang, Jin-Ju Chue, Shih-Lun Chen, Chi-Shi Chen, Jiann-Jenn Wang, Tzi-Dar Chiueh,
Chen, Shih-Lun, Chun-Ming Huang, Chien-Ming Wu, Chih-Chyau Yang, Jin-Ju Chue, Shih-Lun Chen, Chi-Shi Chen, Jiann-Jenn Wang, and Tzi-Dar Chiueh. 2011. “Thermal Analysis for a Novel 3D Heterogenous Integrated Platform MorPack.” IMAPSource Proceedings 2011 (DPC): 2135–59. https://doi.org/10.4071/2011DPC-tha13.