Thermal Analysis for a Novel 3D Heterogenous Integrated Platform MorPack

Shih-Lun Chen; Chun-Ming Huang; Chien-Ming Wu; Chih-Chyau Yang; Jin-Ju Chue; Shih-Lun Chen; Chi-Shi Chen; Jiann-Jenn Wang; Tzi-Dar Chiueh

doi:10.4071/2011DPC-tha13

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Chen, Shih-Lun, Chun-Ming Huang, Chien-Ming Wu, Chih-Chyau Yang, Jin-Ju Chue, Shih-Lun Chen, Chi-Shi Chen, Jiann-Jenn Wang, and Tzi-Dar Chiueh. 2011. “Thermal Analysis for a Novel 3D Heterogenous Integrated Platform MorPack.” IMAPSource Proceedings 2011 (DPC): 2135–59. https://doi.org/10.4071/2011DPC-tha13.

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