Vol. 2011, Issue DPC, 2011January 01, 2011 EDT
Through Package Defect Localization by Lock-In Thermography
Through Package Defect Localization by Lock-In Thermography
Rudolf Schlangen, Herve Deslandes, Toru Toda, Toshinobu Nagatomo, Shigeki Sako, Hiromichi Sawaya,
Schlangen, Rudolf, Herve Deslandes, Toru Toda, Toshinobu Nagatomo, Shigeki Sako, and Hiromichi Sawaya. 2011. “Through Package Defect Localization by Lock-In Thermography.” IMAPSource Proceedings 2011 (DPC): 2160–98. https://doi.org/10.4071/2011DPC-tha14.