Vol. 2011, Issue DPC, 2011January 01, 2011 EDT
Flip Chip for Image Sensor Packaging
Flip Chip for Image Sensor Packaging
Deok-Hoon Kim, Young-Sang Cho, Peter Elenius,
Kim, Deok-Hoon, Young-Sang Cho, and Peter Elenius. 2011. “Flip Chip for Image Sensor Packaging.” IMAPSource Proceedings 2011 (DPC): 1898–1917. https://doi.org/10.4071/2011DPC-wp36.