Flip Chip for Image Sensor Packaging

Deok-Hoon Kim; Young-Sang Cho; Peter Elenius

doi:10.4071/2011DPC-wp36

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Kim, Deok-Hoon, Young-Sang Cho, and Peter Elenius. 2011. “Flip Chip for Image Sensor Packaging.” IMAPSource Proceedings 2011 (DPC): 1898–1917. https://doi.org/10.4071/2011DPC-wp36.

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