ISSN 2380-4505
Vol. 2011, Issue DPC, 2011January 01, 2011 EDT
Solutions for Wafer-Level Packaging of High Brightness LEDs
Solutions for Wafer-Level Packaging of High Brightness LEDs
Thomas Uhrmann, B. Kim, T. Matthias, P. Lindner,
Uhrmann, Thomas, B. Kim, T. Matthias, and P. Lindner. 2011. “Solutions for Wafer-Level Packaging of High Brightness LEDs.” IMAPSource Proceedings 2011 (DPC): 1418–42. https://doi.org/10.4071/2011DPC-wa31.