Vol. 2011, Issue DPC, 2011January 01, 2011 EDT
3DIC & TSV Interconnects: Applications, Market & Infrastructure Readiness
3DIC & TSV Interconnects: Applications, Market & Infrastructure Readiness
Jerome Baron,
Baron, Jerome. 2011. “3DIC & TSV Interconnects: Applications, Market & Infrastructure Readiness.” IMAPSource Proceedings 2011 (DPC): 366–405. https://doi.org/10.4071/2011DPC-keynote1_Yole.