Loading [Contrib]/a11y/accessibility-menu.js
IMAPSource Conference Papers
Menu
Articles
Ceramics Conference Papers
Device Packaging Conference Presentations
General
High Temperature Conference Papers
IMAPS Chapter Conferences
Symposium Proceedings
All
For Authors
Editorial Board
About
Issues
Journal Micro & Elect Pkg
search
Sorry, something went wrong. Please try your search again.
×
Use advanced search instead (articles only)
Articles
Blog posts
RSS Feed
Enter the URL below into your favorite RSS reader.
https://imapsource.org/feed
×
Device Packaging Conference Presentations
Vol. 2011, Issue DPC, 2011
January 01, 2011 EDT
Stacking of Known Good Rebuilt Wafers without TSV - Industrial Applications
Christian Val
,
Pascal Couderc
,
Nadia Boulay
,
known good rebuilt wafers
Stacking
Wafer level
•
https://doi.org/10.4071/2011DPC-tp36
IMAPSource Conference Papers
Val, Christian, Pascal Couderc, and Nadia Boulay. 2011. “Stacking of Known Good Rebuilt Wafers without TSV - Industrial Applications.”
IMAPSource Proceedings
2011 (DPC): 1126–74.
https://doi.org/10.4071/2011DPC-tp36
.
Save article as...
▾
PDF
XML
Citation (BibTeX)
View more stats