Vol. 2011, Issue DPC, 2011January 01, 2011 EDT
Stacking of Known Good Rebuilt Wafers without TSV - Industrial Applications
Stacking of Known Good Rebuilt Wafers without TSV - Industrial Applications
Val, Christian, Pascal Couderc, and Nadia Boulay. 2011. “Stacking of Known Good Rebuilt Wafers without TSV - Industrial Applications.” IMAPSource Proceedings 2011 (DPC): 1126–74. https://doi.org/10.4071/2011DPC-tp36.
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