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Device Packaging Conference Presentations
Vol. 2011, Issue DPC, 2011
January 01, 2011 EDT
3D Packages with TSV Silicon Interposers
Mike Kelly
,
TSV
Assembly
Die Stacking
•
https://doi.org/10.4071/2011DPC-tp11
IMAPSource Conference Papers
Kelly, Mike. 2011. “3D Packages with TSV Silicon Interposers.”
IMAPSource Proceedings
2011 (DPC): 754–65.
https://doi.org/10.4071/2011DPC-tp11
.
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