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Device Packaging Conference Presentations
Vol. 2011, Issue DPC, 2011January 01, 2011 EDT

Low Profile Silicon Interposer using Passive Integration (PICS)

Catherine Bunel, Stephane Bellenger, Sebastien Leruez, Lionel Lenoir, Franck Murray,
IPD 3D WLP
• https://doi.org/10.4071/2011DPC-wp41
IMAPSource Conference Papers
Bunel, Catherine, Stephane Bellenger, Sebastien Leruez, Lionel Lenoir, and Franck Murray. 2011. “Low Profile Silicon Interposer Using Passive Integration (PICS).” IMAPSource Proceedings 2011 (DPC): 1918–48. https://doi.org/10.4071/2011DPC-wp41.
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