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Device Packaging Conference Presentations
Vol. 2011, Issue DPC, 2011January 01, 2011 EDT

Cu Pillar Bumping Technology with Solder Alloy Versatility

Guy Burgess, Anthony Curtis, Tom Nilsson, Gene Stout, Theodore G. Tessier,
Cu Pillar Bumping Flip Chip Assembly Flip Chip in Package Reliability
• https://doi.org/10.4071/2011DPC-tha31
IMAPSource Conference Papers
Burgess, Guy, Anthony Curtis, Tom Nilsson, Gene Stout, and Theodore G. Tessier. 2011. “Cu Pillar Bumping Technology with Solder Alloy Versatility.” IMAPSource Proceedings 2011 (DPC): 2360–76. https://doi.org/10.4071/2011DPC-tha31.
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