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Device Packaging Conference Presentations
Vol. 2011, Issue DPC, 2011
January 01, 2011 EDT
Cu Pillar Bumping Technology with Solder Alloy Versatility
Guy Burgess
,
Anthony Curtis
,
Tom Nilsson
,
Gene Stout
,
Theodore G. Tessier
,
Cu Pillar Bumping
Flip Chip Assembly
Flip Chip in Package Reliability
•
https://doi.org/10.4071/2011DPC-tha31
IMAPSource Conference Papers
Burgess, Guy, Anthony Curtis, Tom Nilsson, Gene Stout, and Theodore G. Tessier. 2011. “Cu Pillar Bumping Technology with Solder Alloy Versatility.”
IMAPSource Proceedings
2011 (DPC): 2360–76.
https://doi.org/10.4071/2011DPC-tha31
.
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