Vol. 2011, Issue DPC, 2011January 01, 2011 EDT
Cu Pillar Bumping Technology with Solder Alloy Versatility
Cu Pillar Bumping Technology with Solder Alloy Versatility
Guy Burgess, Anthony Curtis, Tom Nilsson, Gene Stout, Theodore G. Tessier,
Burgess, Guy, Anthony Curtis, Tom Nilsson, Gene Stout, and Theodore G. Tessier. 2011. “Cu Pillar Bumping Technology with Solder Alloy Versatility.” IMAPSource Proceedings 2011 (DPC): 2360–76. https://doi.org/10.4071/2011DPC-tha31.