Vol. 2011, Issue DPC, 2011January 01, 2011 EDT
Flip Chip and Wafer Level Packaging - Past, Present and Future
Flip Chip and Wafer Level Packaging - Past, Present and Future
Elenius, Peter. 2011. “Flip Chip and Wafer Level Packaging - Past, Present and Future.” IMAPSource Proceedings 2011 (DPC): 406–33. https://doi.org/10.4071/2011DPC-keynote2_E_G.
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