Vol. 2011, Issue DPC, 2011January 01, 2011 EDT
SiP(System in Package) Solutions with Wafer Level Packaging Technology
SiP(System in Package) Solutions with Wafer Level Packaging Technology
Kang, In Soo, and Jong Heon (Jay) Kim. 2011. “SiP(System in Package) Solutions with Wafer Level Packaging Technology.” IMAPSource Proceedings 2011 (DPC): 2226–53. https://doi.org/10.4071/2011DPC-tha21.
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