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Device Packaging Conference Presentations
Vol. 2011, Issue DPC, 2011
January 01, 2011 EDT
SiP(System in Package) Solutions with Wafer Level Packaging Technology
In Soo Kang
,
Jong Heon (Jay) Kim
,
Wafer Level Embedded Package
Fanout package
TSV and IPD
•
https://doi.org/10.4071/2011DPC-tha21
IMAPSource Conference Papers
Kang, In Soo, and Jong Heon (Jay) Kim. 2011. “SiP(System in Package) Solutions with Wafer Level Packaging Technology.”
IMAPSource Proceedings
2011 (DPC): 2226–53.
https://doi.org/10.4071/2011DPC-tha21
.
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