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Device Packaging Conference Presentations
Vol. 2011, Issue DPC, 2011January 01, 2011 EDT

SiP(System in Package) Solutions with Wafer Level Packaging Technology

In Soo Kang, Jong Heon (Jay) Kim,
Wafer Level Embedded PackageFanout packageTSV and IPD
https://doi.org/10.4071/2011DPC-tha21
IMAPSource Conference Papers
Kang, In Soo, and Jong Heon (Jay) Kim. 2011. “SiP(System in Package) Solutions with Wafer Level Packaging Technology.” IMAPSource Proceedings 2011 (DPC): 2226–53. https:/​/​doi.org/​10.4071/​2011DPC-tha21.
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