Vol. 2011, Issue DPC, 2011January 01, 2011 EDT
3D-IC Integration Using D2C or D2W Alignment Schemes Together with Local Oxide Reduction
3D-IC Integration Using D2C or D2W Alignment Schemes Together with Local Oxide Reduction
Gilbert Lecarpentier, Jean-Stephane Mottet, Keith Cooper, Michael Stead,
Lecarpentier, Gilbert, Jean-Stephane Mottet, Keith Cooper, and Michael Stead. 2011. “3D-IC Integration Using D2C or D2W Alignment Schemes Together with Local Oxide Reduction.” IMAPSource Proceedings 2011 (DPC): 1291–1315. https://doi.org/10.4071/2011DPC-wa13.