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Device Packaging Conference Presentations
Vol. 2011, Issue DPC, 2011
January 01, 2011 EDT
Evalulation of Electrodeposited Photoresists for use in the Fabrication of an Optochip Silicon Interposer
Cornelia Tsang
,
Janet Okada
,
Eric Huenger
,
Optochip
Image sensors
Lithography
Electrodeposited photoresist
3D packaging
Optochip
silicon interposer
optical devices
image sensors
lithography
MEMS
•
https://doi.org/10.4071/2011DPC-wp13
IMAPSource Conference Papers
Tsang, Cornelia, Janet Okada, and Eric Huenger. 2011. “Evalulation of Electrodeposited Photoresists for Use in the Fabrication of an Optochip Silicon Interposer.”
IMAPSource Proceedings
2011 (DPC): 1555–95.
https://doi.org/10.4071/2011DPC-wp13
.
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