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Device Packaging Conference Presentations
Vol. 2011, Issue DPC, 2011January 01, 2011 EDT

Novel Wet Chemical Copper Metallization for Glass Interposers

Simon Bamberg, Ralf Bruening, Johannes Etzkorn, Frank Bruening,
Glass interposer Chemical copper metallization Adhesion improvement
• https://doi.org/10.4071/2011DPC-wp12
IMAPSource Conference Papers
Bamberg, Simon, Ralf Bruening, Johannes Etzkorn, and Frank Bruening. 2011. “Novel Wet Chemical Copper Metallization for Glass Interposers.” IMAPSource Proceedings 2011 (DPC): 1535–54. https://doi.org/10.4071/2011DPC-wp12.
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