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Device Packaging Conference Presentations
Vol. 2011, Issue DPC, 2011
January 01, 2011 EDT
Novel Wet Chemical Copper Metallization for Glass Interposers
Simon Bamberg
,
Ralf Bruening
,
Johannes Etzkorn
,
Frank Bruening
,
Glass interposer
Chemical copper metallization
Adhesion improvement
•
https://doi.org/10.4071/2011DPC-wp12
IMAPSource Conference Papers
Bamberg, Simon, Ralf Bruening, Johannes Etzkorn, and Frank Bruening. 2011. “Novel Wet Chemical Copper Metallization for Glass Interposers.”
IMAPSource Proceedings
2011 (DPC): 1535–54.
https://doi.org/10.4071/2011DPC-wp12
.
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