Vol. 2011, Issue DPC, 2011January 01, 2011 EDT
Aerosol Jet Printer as an Alternative to Wire Bond and TSV Technology for 3D Interconnect Applications
Aerosol Jet Printer as an Alternative to Wire Bond and TSV Technology for 3D Interconnect Applications
O’Reilly, Michael, Michael J. Renn, and Stephen Barnes. 2011. “Aerosol Jet Printer as an Alternative to Wire Bond and TSV Technology for 3D Interconnect Applications.” IMAPSource Proceedings 2011 (DPC): 1250–68. https://doi.org/10.4071/2011DPC-wa11.
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