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Device Packaging Conference Presentations
Vol. 2011, Issue DPC, 2011January 01, 2011 EDT

Aerosol Jet Printer as an Alternative to Wire Bond and TSV Technology for 3D Interconnect Applications

Michael O'Reilly, Michael J. Renn, Stephen Barnes,
3D InterconnectsWire bond AlternativeHigh Trhoughput
https://doi.org/10.4071/2011DPC-wa11
IMAPSource Conference Papers
O’Reilly, Michael, Michael J. Renn, and Stephen Barnes. 2011. “Aerosol Jet Printer as an Alternative to Wire Bond and TSV Technology for 3D Interconnect Applications.” IMAPSource Proceedings 2011 (DPC): 1250–68. https:/​/​doi.org/​10.4071/​2011DPC-wa11.
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