Vol. 2011, Issue DPC, 2011January 01, 2011 EDT
Can High Density 3D Through Silicon Stacking Replace Lithography-Driven CMOS Scaling as the Engine for the Semiconductor Industry?
Can High Density 3D Through Silicon Stacking Replace Lithography-Driven CMOS Scaling as the Engine for the Semiconductor Industry?
Nowak, Matt, and Brian Henderson. 2011. “Can High Density 3D Through Silicon Stacking Replace Lithography-Driven CMOS Scaling as the Engine for the Semiconductor Industry?” IMAPSource Proceedings 2011 (DPC): 458–75. https://doi.org/10.4071/2011DPC-ta12.
Powered by Scholastica, the modern academic journal management system