Vol. 2011, Issue DPC, 2011January 01, 2011 EDT
Electromigration Reliability of Cu Pillar on Substrate Interconnects in High Performance Flip Chip Packages
Electromigration Reliability of Cu Pillar on Substrate Interconnects in High Performance Flip Chip Packages
Katkar, Rajesh, Michael Huynh, and Laura Mirkarimi. 2011. “Electromigration Reliability of Cu Pillar on Substrate Interconnects in High Performance Flip Chip Packages.” IMAPSource Proceedings 2011 (DPC): 2404–23. https://doi.org/10.4071/2011DPC-tha33.
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