ISSN 2380-4505
Vol. 2011, Issue DPC, 2011January 01, 2011 EDT
Electromigration Reliability of Cu Pillar on Substrate Interconnects in High Performance Flip Chip Packages
Electromigration Reliability of Cu Pillar on Substrate Interconnects in High Performance Flip Chip Packages
Rajesh Katkar, Michael Huynh, Laura Mirkarimi,
Katkar, Rajesh, Michael Huynh, and Laura Mirkarimi. 2011. “Electromigration Reliability of Cu Pillar on Substrate Interconnects in High Performance Flip Chip Packages.” IMAPSource Proceedings 2011 (DPC): 2404–23. https://doi.org/10.4071/2011DPC-tha33.